Resist technology, processing

Sugiyama, H. Inoue, T. Mizushlma, A. Nate, K. Proc. of SPIE. Advances In Resist Technology and Processing 1988, 920. 268. 

Kawai, Y. Tanaka, A. Ozaki, Y. Takamoto, K. Yoshikawa, A. Proc. of SPIE, Advances in Resist Technology and Processing in press... 

Photo-resist technology is widely used for imaging processes in such applications in electronics. If it is wished to produce a metallic pattern of connections between many electronic components (resistors, capacitors, integrated circuits, etc.), this can be done by the selective etching of a thin copper plate deposited on an insulating base. The copper layer is protected by a resist which is a polymer, deposited in such a way that it prevents the attack of the metal by an etching solution which will solubilize only the unprotected, exposed copper (Figure 6.8). 

Tagawa S, Kouchi N, Shibata H, Tabata Y (1989) Adv in Resist Technology and Processing VL SPIE Symp 1086 65... 

Fedynyshyn TH (ed) (2002) Advances in Resist Technology and Processing XIX Proceedings of SPIE Vol. 4690... 

S. Nonogaki, M. Hashimoto, T. Iwayanagi, and H. Shiraishi, Proc. SPIE 539, Advances in Resist Technology and Processing II, 189-193 (1985). 

Multilayer resist technology offers a number of advantages in the generation of relief images but carries the burden of process complexity. We wish to report a novel process that greatly simplifies the optical MLR sequence. This concept is based on selective surface modification of the resist with a reactive dye which masks selected areas toward later flood exposure and solvent development. 

Coopmans, F. Roland, B. SPIE Proceedings. Advances in Resist Technology and Processing HI. 1986,631, p 34. 

SPIE Conferences on Advances in Resist Technology and Processing and Optical Microlithography. 1986, 631 and 6, 9-14 March, Santa Clara, CA. 

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