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Resist image with mask aligner

Figure 17. Resist images delineated with a GCA DSW 4800 mask aligner. The Ag2Se/Geo.iSeo.9/// Pi two-layer inorganic RIE PCM system was used. The HPR planarizing layer was 2.5 in thickness. ((Reproduced with permission from Ref. 27 J... Figure 17. Resist images delineated with a GCA DSW 4800 mask aligner. The Ag2Se/Geo.iSeo.9/// Pi two-layer inorganic RIE PCM system was used. The HPR planarizing layer was 2.5 in thickness. ((Reproduced with permission from Ref. 27 J...

See other pages where Resist image with mask aligner is mentioned: [Pg.309]    [Pg.59]    [Pg.196]    [Pg.10]    [Pg.290]    [Pg.335]    [Pg.276]    [Pg.126]    [Pg.347]    [Pg.2713]    [Pg.1636]   
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