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Pumpdown base pressure

These sources of gases and vapors determine the lowest pressure (base pressure) that can be reached in a given time (pumpdown time), the gas/vapor (contaminant) species in the system at any time, and how fast the chamber pressure rises after the pumping is stopped i.e., the leakup rate or leak-back rate . Figure 3.6 shows a typical pumpdown curve with fast, slow, and very slow leakup rates after the pumping system has been isolated. [Pg.88]

Base pressure (vacuum technology) The specified pressure at which the system begins the next sequence in processing. See also Pumpdown time Ultimate pressure. [Pg.567]

Duty cycle (process) The ratio of the time of the processing sequence, such as pumpdown to a base pressure in the total process cycle time or actual sputtering time per voltage cycle in pulse power sputtering, to the process cycle time of interest. [Pg.602]

Pumpdown time The time for a vacuum system to reach a specified pressure such as the Base pressure. [Pg.681]


See other pages where Pumpdown base pressure is mentioned: [Pg.142]   
See also in sourсe #XX -- [ Pg.88 , Pg.134 ]




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