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Processing structural component properties

Influences of Process and Plastic on the Structural Component Properties. 248... [Pg.168]

In Section Influences of process and plastic on the structural component properties, die swell is explained as one example of molecular orientation in the extrusion process. [Pg.181]

Many of the relationships described in detail below, in most cases for injection molding of thermoplastics, between the process parameters and the structural component properties are applicable to other processes when modified accordingly. [Pg.249]

Molecular orientations resulting from shearing forces applied during processing vary widely depending on the process. In injection molding of thermoplastics and TPEs, molecular and fiber orientations have a dominant influence on the structural component properties. [Pg.256]

The influence of molecular and fiber orientations on structural component properties is significant. Internal stress in structural components as a result of processing constitute a further important influential factor. [Pg.256]

A.Yu. Zakharov, V.V. Lebedev. To the theory of reconstruction processes in multi-component condensed systems. // Electron structure and properties of refractory compounds, alloys andmetals. /Proceedings of IAM NAS of Ukraine, 2004, p. 13-21. [Pg.214]

Four types of fundamental subjects are involved in the process represented by Eq. (1.1) (1) metal-solution interface as the locus of the deposition process, (2) kinetics and mechanism of the deposition process, (3) nucleation and growth processes of the metal lattice (Mi ttice), and (4) structure and properties of the deposits. The material in this book is arranged according to these four fundamental issues. We start by considering in the first three chapters the basic components of an electrochemical cell for deposition. Chapter 2 treats water and ionic solutions Chapter 3, metal and metal surfaces and Chapter 4, the metal-solution interface. In Chapter 5 we discuss the potential difference across an interface, and in Chapter 6,... [Pg.1]

The metal-solution interface as the locus of the deposition processes. This interface has two components a metal and an aqueous ionic solution. To understand this interface, it is necessary to have a basic knowledge of the structure and electronic properties of metals, the molecular structure of water, and the structure and properties of ionic solutions. The structure and electronic properties of metals are the subject matter of solid-state physics. The structure and properties of water and ionic solutions are (mainly) subjects related to chemical physics (and physical chemistry). Thus, to study and understand the structure of the metal-solution interface, it is necessary to have some knowledge of solid-state physics as well as of chemical physics. Relevant presentations of these subjects are given in Chapters 2 and 3. [Pg.2]

If the mobile phase is present in a significant concentration, as suggested by the results of solvent extraction studies (1,8), the practical meaning of the mobile phase to coal conversion processes may be profound. In coal liquefaction, two stage processes emphasizing the mobile phase and the macromolecular structure separately could well be most economical. In devolatilization kinetics, at least two sets of kinetic parameters are necessary to model the devolatilization phenomena associated with the mobile phase and the macromolecular structure respectively since the mobile phase components devolatilize at much lower temperatures than the macromolecular structure components 0. In addition, the mobile phase appears to have a significant influence on the thermoplastic properties of coal (0 and thereby on coke quality. [Pg.90]

With an understanding of the structure and properties of engineering materials now firmly in place, we can discuss how these materials can be formed or fabricated into useful products and components. Most of the important processing methods are described here, with little or no distinction made between microscale and macroscale processes—for example, processes that form both integrated circuits and components for highway bridges are described here. The common thread is that all the chemical and physical phenomena needed to introduce these processing techniques have already been described in the previous chapters. [Pg.681]

Two basic types of components may be distinguished active components, that perform a given operation (accept, donate, transfer) on photons, electrons, ions, etc. structural components, that participate in the build-up of the supramolecular architecture and in the positioning of the active components, in particular through recognition processes in addition, ancillary components may be introduced to modify or perturb the properties of the other two types of components. A basic feature is that the components and the devices that they constitute should perform their function ) at the molecular and supramolecular levels as distinct from the bulk material. Incorporation of molecular devices into supramolecular architectures yields functional supermolecules or assemblies (such as layers, films, membranes, etc.). [Pg.89]


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See also in sourсe #XX -- [ Pg.245 ]




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