Processing Effects on Residual Stresses

The modeling of residual stress development during cure can be used to optimize the processing conditions to reduce or control residual stresses. The current process model is used next to assess the effects of several processing conditions on residual stresses. Reduced cure temperature, longer dwell times, slower cool down rate, and the use of novel cure cycles are all feasible for the reduction of residual stresses. 

Cure temperature (°C) a Degree of cure Et (GPa) transverse modulus [standard deviation] XT (MPa) transverse strength [standard deviation] 

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