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Precious Metal Plating

Both aqueous and fused-salt electrol3rtes have been used for plating the platinum group elements. Platinum has been used as a diffusion-barrier layer in aluminiding nickel-base alloys and MCrAlY coatings. Platinum [Pg.149]


DSA-02 oxide-coated Ti anode (DSA = Dimensionally Stable Anode) is placed, thus creating a large cathode volume. The effluent solution flows perpendicularly through the electrodes with a typical flow rate of 0.5 dm3 s-1. The flowthrough metal electrodes have an active area approximately 15 times their geometric area. The cell allows air sparging to increase the mass-transfer. The current efficiency is about 40% when the inlet concentration of the metal ions is 150 to 1500 ppm and the concentration at the out-let is about 50 ppm. The cell is currently used for the treatment of recirculated wash-waters from acid copper, copper cyanide, zinc cyanide, zinc chloride, cadmium sulphate, cadmium cyanide and precious metal plating and washwaters from electroless copper deposition. Since the foam metal electrodes are relatively expensive the electrodes... [Pg.190]

Precious Metal Plating Process Catalog, N. E. CHEM CAT, 2001. [Pg.510]

Fig. 8.15 A facility for manual electroplating. The modular equipment is suitable for both rack- and barrel-plating. Construction materials include corrosion-resistant PVC-clad steel and stainless steel. Applications include precious-metal plating in the electronics industry. Power supply and control circuitry are located above the tanks. (Courtesy PMD Chemicals Ltd.)... Fig. 8.15 A facility for manual electroplating. The modular equipment is suitable for both rack- and barrel-plating. Construction materials include corrosion-resistant PVC-clad steel and stainless steel. Applications include precious-metal plating in the electronics industry. Power supply and control circuitry are located above the tanks. (Courtesy PMD Chemicals Ltd.)...
Precious Metal Plating, J. Fischer, D. E. Weuner, Robert Draper, Teddington, 1964. [Pg.271]

Precious metals Electroplating Electroless plating Conversion coating... [Pg.349]

The main difference in SOFC stack cost structure as compared to PEFC cost relates to the simpler system configuration of the SOFC-based system. This is mainly due to the fact that SOFC stacks do not contain the type of high-cost precious metals that PEFCs contain. This is off-set in part by the relatively complex manufacturing process required for the manufacture of the SOFC electrode electrolyte plates and by the somewhat lower power density in SOFC systems. Low temperature operation (enabled with electrode supported planar configuration) enables the use of low cost metallic interconnects which can be manufactured with conventional metal forming operations. [Pg.49]


See other pages where Precious Metal Plating is mentioned: [Pg.188]    [Pg.147]    [Pg.150]    [Pg.188]    [Pg.147]    [Pg.150]    [Pg.147]    [Pg.150]    [Pg.589]    [Pg.590]    [Pg.757]    [Pg.149]    [Pg.293]    [Pg.258]    [Pg.188]    [Pg.147]    [Pg.150]    [Pg.188]    [Pg.147]    [Pg.150]    [Pg.147]    [Pg.150]    [Pg.589]    [Pg.590]    [Pg.757]    [Pg.149]    [Pg.293]    [Pg.258]    [Pg.134]    [Pg.382]    [Pg.493]    [Pg.109]    [Pg.154]    [Pg.509]    [Pg.193]    [Pg.435]    [Pg.452]    [Pg.557]    [Pg.563]    [Pg.4]    [Pg.450]    [Pg.502]    [Pg.521]    [Pg.531]    [Pg.195]    [Pg.11]    [Pg.373]    [Pg.53]    [Pg.791]    [Pg.477]    [Pg.496]    [Pg.506]    [Pg.37]   


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Plated Metals

Precious metals

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