Post optical microscopy

For optical microscopy, representative sections of material were cut, potted, and polished for each post-conditioning group and examined using an inverted optical microscope. Though this initial study some data was reported. 

Optical microscopy is also used for post-test analysis based on cut, ground, and poHshed samples. Fields of application are the analysis of layer thicknesses for layers thicker than 10 qm, contact areas, microstructures, geometric aspects such as tolerances and distances, and overview pictures for further SEM/EDX... 

In addition to the widely used techniques of photography, optical microscopy, SEM, thermography, topography, measurement by tools, XRD, and wet chemical analysis, there are various other techniques that can be appUed to post-test SOFC stack analysis. A few examples are given below, but this hst does not claim to be exhaustive ... 

The hardness of GST is only 2.3—2.4 GPa [5], while the hardness values of A1 and Cu are 0.5—1.2 and 3.0 GPa, respectively. So GST is a relatively soft material. Hence, it can be easily scratched during CMP by hard materials like the pad, agglomerated large silica particles, diamond particles from conditioner, and so on. Figure 19.2 shows a typical optical microscopy (OM) image of a post-CMP GST surface polished using... 

Post-test disc wear tracks were measured with a 2-D Talysurf profilometer. For each wear track, four measurements were carried out and the average of the four measurements was used to calculate the disc volume loss, see equation (1). Pin wear scars were measured under optical microscopy. The average of two diameters (the largest and the smallest diameter across the wear scar) was used to calculate the volume loss of the pin [23], see equation (2) while the height of the worn pin can be... 

Fig. 6 (A) Anodized alumina, posted microreactor used for reforming of ammonia to hydrogen. (B) Optical microscope image of the microreactor posts. (C) Scanning electron microscopy image of a microreactor postsurface illustrating the porosity of the anodized surface. (View this art in color at www.dekker.com.)...

In Transmission Electron Microscopy (TEM), a very high energy monoenergetic electron beam (100 to 400 keV) passes through a thin specimen (less than 1000 nm) of diameter less than 3 mm (necessary to fit in the electron optics column). A series of post specimen lenses transmits the emerging electrons, with spatial magnification up to 1,000,000, to a detector (fluorescent screen or video camera) viewed in real time. 

In the post-WWII period, Ruska continued to further perfect the electron microscope as a department head at Siemens. In 1954, Elmiskop I, developed by E. Ruska, was put on the market, and the sale of about 1000 of these instruments over the next ten years substantially contributed to the spread and acceptance of electron microscopy. Ruska played a key role not only as a design engineer, but also as a figmehead for German electron microscopists. Starting in 1949 he was able to make use of the facilities of the future Fritz Haber Institute, to which he fully relocated in 1955, and where, two years later, he became the head of a sub-institute for electron microscopy he stayed at the Institute until his retirement in 1974. Two years before his death, the already highly decorated Ruska received the 1986 Physics Nobel Prize, for his fundamental work in electron optics, and for the design of the first electron microscope. ... 

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