Polyimides Kapton* tape

In tape-automated bonding (TAB), the semiconductor die, fabricated with bumped interconnect pads, are positioned in apertures of a polymer-film tape, generally polyimide (Kapton , a registered trademark of DuPont), then gang-bonded to cantilevered beams that are formed by photodelineated metal pads on the tape. The tape (film) has sprocket holes along its sides similar to movie film and, like movie film, is handled on reels in automatic equipment for high-speed assembly. ... 

In contrast, the consumption of polyimides has increased in the electronic industry, especially for the fabrication of flexible circuitry and its associated tape automated bonding process. High level of adhesion and thermoplasticity are the prominent parameters for these applications. Compared to aerospace applications, electronics imposes new requirements because of the exposition to high temperatures that is generally fimited to short-time exposures at 350 to 400°C. In the aerospace industry, Larc-TPI performs well to bond Kapton to itself as to... 

Polyimides are made similarly from diamines and dianhydrides. Dupont s Kapton polyimide was the first commercially significant polyimide. It is made from pyromellitic dianhydride and oxydianiline. Kapton has good heat and strength properties and is used for specialty applications including space applications. It is used in electronics and in both film and tape applications. 

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