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Polycrystalline material, grain boundaries

Grains and their sizes are very important variables characterizing the microstructure of polycrystalline materials. Grain-boundary movement plays a significant role in the characteristic behavior of materials for creep application. [Pg.480]

The coexistence of crystals and deeply supercooled liquids was suspected already one century ago for bulk systems [45]. More recently, the ice-water coexistence was reported by experiments, especially in the temperature range 140-21 OK [46-49], and by simulations in NML [50,51], evidencing the presence of 15-20% of liquid water between nanometer-sized icecrystals [50]. Notably, recent simulations concluded that in polycrystalline materials grain boundaries exhibit the dynamics of glass-forming liquids [52]. [Pg.17]

Grain boundaries have a significant effect upon the electrical properties of a polycrystalline solid, used to good effect in a number of devices, described below. In insulating materials, grain boundaries act so as to change the capacitance of the ceramic. This effect is often sensitive to water vapor or other gaseous components in the air because they can alter the capacitance when they are absorbed onto the ceramic. Measurement of the capacitance allows such materials to be used as a humidity or gas sensor. [Pg.122]

In polycrystalline materials, ion transport within the grain boundary must also be considered. For oxides with close-packed oxygens, the O-ion almost always diffuses much faster in the boundary region than in the bulk. In general, second phases at grain boundaries are less close packed and provide a pathway for more rapid diffusion of ionic species. Thus the simplified picture of bulk ionic conduction is made more complex by these additional effects. [Pg.354]

Fig. 10.4. Ball bearings can be used to simulate how atoms are packed together in solids. Our photograph shows a ball-bearing model set up to show what the grain boundaries look like in a polycrystalline material. The model also shows up another type of defect - the vacancy - which is caused by a missing atom. Fig. 10.4. Ball bearings can be used to simulate how atoms are packed together in solids. Our photograph shows a ball-bearing model set up to show what the grain boundaries look like in a polycrystalline material. The model also shows up another type of defect - the vacancy - which is caused by a missing atom.
The obvious application of microfocus Raman spectroscopy is the measurement of individual grains, inclusions, and grain boundary regions in polycrystalline materials. No special surface preparation is needed. Data can be obtained from fresh fracture surfeces, cut and polished surfaces, or natural surfeces. It is also possible to investigate growth zones and phase separated regions if these occur at a scale larger than the 1-2 pm optical focus limitation. [Pg.438]

The sputtering process is frequendy used in both the processing (e.g., ion etching) and characterization of materials. Many materials develop nonuniformities, such as cones and ridges, under ion bombardment. Polycrystalline materials, in particular, have grains and grain boundaries that can sputter at different rates. Impurities can also influence the formation of surface topography. ... [Pg.704]

This kind of microstructure also influences other kinds of conductors, especially those with positive (PTC) or negative (NTC) temperature coefficients of resistivity. For instance, PTC materials (Kulwicki 1981) have to be impurity-doped polycrystalline ferroelectrics, usually barium titanate (single crystals do not work) and depend on a ferroelectric-to-paraelectric transition in the dopant-rich grain boundaries, which lead to enormous increases in resistivity. Such a ceramic can be used to prevent temperature excursions (surges) in electronic devices. [Pg.273]

Conventional electrodeposition from solutions at ambient conditions results typically in the formation of low-grade product with respect to crystallinity, that is, layers with small particle size, largely because it is a low-temperature technique thereby minimizing grain growth. In most cases, the fabricated films are polycrystalline with a grain size typically between 10 and 1,000 nm. The extensive grain boundary networks in such polycrystalline materials may be detrimental to applications for instance, in semiconductor materials they increase resistivity... [Pg.87]

The behavior of polycrystalline materials is often dominated by the boundaries between the crystallites, called grain boundaries. In metals, grain boundaries prevent dislocation motion and reduce the ductility, leading to hard and brittle mechanical properties. Grain boundaries are invariably weaker than the crystal matrix, and... [Pg.120]

The effect only occurs in polycrystalline samples. Single-crystal materials do not show the PTC effect. Because of this, the effect can be attributed to the presence of grain boundaries in the solid. The microstructure of the material,... [Pg.126]


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See also in sourсe #XX -- [ Pg.91 ]




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Boundary/boundaries grains

Polycrystalline

Polycrystalline material, grain

Polycrystallines

Polycrystallinity

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