Poly lithography

Poly(vinyl cinnamate) is not used in the traditional areas of plastics technology but its ability to cross-link on exposure to light has led to important applications in photography, lithography and related fields as a photoresist. 

A photosensitive composition, consisting of an aromatic azide compound (4,4 -diazidodi-phenyl methane) and a resin matrix (poly (styrene-co-maleic acid half ester)), has been developed and evaluated as a negative deep UV resist for high resolution KrF excimer laser lithography. Solubility of this resist in aqueous alkaline developer decreases upon exposure to KrF excimer laser irradiation. The alkaline developer removes the unexposed areas of this resist. 

A negative deep UV resist, consisting of a photosensitive 4,4 -diazidodiphenyl methane and a poly-(styrene-co-maleic acid half ester) resin, has been found to meet the requirements needed for KrF excimer laser lithography. 

Poly(2-acrylamido-2-methyl-l-propanesulfonic acid and isopropylhexafluor-oalcohol), (IV), was prepared by Khojasteh et al. (4) and used as a top antireflective coating and barrier layer for immersion lithography. 

Listeria monocytogenes cells partitioned between organic/ aqueous medium Poly(allylamine) used in presence of diacid chloride Polymeric microcapsules (bacteria-mediated lithography) NS Aheme et al., 1996 Whitcombe et al., 1997... 

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