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PLACEMENT OF DEVICES AND COMPONENTS

After the adhesive has been dispensed onto the PCBs or other interconnect substrate, bare die and other eleetronie components must be precisely placed. Of course, piek and plaee can be done manually using [Pg.243]

A wide variety of fully automatic machines exist. Generally, feeders, which may consist of tape-and-reel, stick, or tray, deliver the parts individually so they ean be picked up and automatically inspected. Machines are equipped with vacuum nozzles to pick up the components and carry them through inspection, alignment, and placement. A list and description of commercially available component placement equipment is given in Table 4.24. [Pg.244]

Model/Supplier Board Sizes (in X in) Throughput (placement /hr) Placement Accuracy Part Types Placed [Pg.245]

TP9-2U/Mydata Automation 4,800 Wide range of componen including SQICs [Pg.245]

Quad IVcMk268/ Quad 0.06 mm (accuracy), 0.03 mm (precision) 0402 to PLCC68 [Pg.245]


See other pages where PLACEMENT OF DEVICES AND COMPONENTS is mentioned: [Pg.143]    [Pg.197]    [Pg.243]    [Pg.243]   


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