Photonics polyimide film

There are several ways (see Fig. 5) in which polyimides have been used in applications where photoimaging is required to produce a pattern on a substrate (typically silicon, or other materials including polyimide itself) (205). The first method is reactive ion etching (RIE) (includes plasma etching) or photoablation. This method does not require a photosensitive material, only a mask that can withstand the reactive ion gas or photons, and the material to be patterned, which is protected by the mask. In RIE, the reactive ions, generated by an RF field, attack the exposed polyimide to etch out the pattern of the mask. This process can be used with conventional polyimide film and requires few steps, but is not highly accurate and requires a hard (metal, silicon, etc) mask. The other methods... 

In the case of the Epiclon-based polyimide films, the absorption edges were found to follow the Tauc power law expressed in equation (10), in the range over which photon energy was higher than optical gap energy, Eg ... 

In such heterogeneous LB films, the long alkyl chains are intervened between the A and S and between the S and D moieties. As a result, parts of the excited sensitizers were deactivated by the emission of photons (Fig. 18b, vii) without quenching by electron transfer. To cope with this problem, Kakimoto, Imai, and their coworkers used polyimide LB... 

Girton, D. G., Ermer, S., Valley, J. F Van Eck, T. E., Lovejoy, S., Leung, D., and Marley, J. A., Poling considerations for DCM-polyimide systems used in electro-optic devices, in ASCI OSA Proceedings on Polymeric Thin Films for Photonic Applications, 1994. 

Polyimides (PI) are widely used in microelectronics and photonics because of their outstanding electrical properties, heat resistance, and chemical stability [10-12], Pl/clay nanocomposites have been reported to reduce the coefficient of thermal expansion, amount of moisture absorption, and dielectric constant for improved performance in these application areas already mentioned [13-22], For example, Yano et al. [13] prepared a PI (pyromellitic anhydride-4,4 -oxydianiline)/clay composite film [(PMDA-ODA)/clay] by solution-mixing of polyamic acid (PAA) and a dimethylacetamide (DMA) dispersion of clay. They used dodecylamine as the clay modifier, and the film showed reduced thermal... 

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