Permeability electroless deposition

Since reaction (19.12) is the only source of deuterium in the course of electroless Ni-P deposition, the rate of reactions (19.11) and (19.12) can be studied by online mass spectrometry under open-circuit conditions as well as a function of the electrode potential similar to analogous measurements in Ni(II)-ffee hypophosphite solutions (see Sections 19.6.1 and 19.6.2). To avoid changes in the membrane permeability due to nickel deposition, each measurement has been carried out on a new specimen of the Ni-sputtered Teflon membrane. 

Several researchers are investigating the feasibility of Pd-based membranes deposited onto highly permeable, porous metal and/or ceramic substrates. Fig. 10.7a [76,116-119]. Currently, the most common method used for the deposition of the active membrane layer onto the porous substrate is electroless plating, although some researchers have utilized physical and chemical vapor deposition techniques. 

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