Pattern conformal adhesion

A recently reported alternative to spin or spray coating is screen printing of polyimide solutions (82, 85, 90). Screen printing is a low-cost, high-throughput process capable of directly patterning the polyimide films as they are deposited. Another alternative is the vapor deposition of polyimides, which was reported by researchers who co-evaporated the diamine and dianhydride monomers at stoichiometric rates (140). The evaporated films had better adhesion, a lower dielectric constant, and a lower dissipation factor compared with spin-coated polyimides. With this process, uniform, defect-free, conformal films can be cured in situ during deposition. 

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