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Passive components in package

In the time frame of 10 years, we believe the 2.5-D integration will enable the VLSI systems to achieve superior performance that is impossible for their monolithic implementations. In this section we discuss two such examples. [Pg.155]

As the first example of future high performance 2.5-D integrated systems, we [Pg.155]


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In packaging

Packaging components

Passive components

Passive packaging

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