Parameters Which Affect Sn Whisker Growth

Measurement of the Parameters Which Affect Sn Whisker Growth 

In the following, we discuss cross-sectional scanning and transmission electron microscopy study of Sn whisker, the effect of surface oxide on whisker growth, synchrotron radiation microdiffraction study of Sn whisker, and kinetic model of Sn whisker growth. 

Cross-Sectional Scanning and Transmission Electron Microscopy Study of Sn Whisk- 

10 SEM image of an area of the surface of Sn-Cu finish ° with two rectangular holes etched into the Sn-Cu by 

Most of these grain boundary Cu Sns particles precipitated out during the electroplating of the eutectic Sn-Cu alloy. If the Sn-Cu finish has experienced a reflow, most of these grain boundary CugSns particles should have precipitated out during the solidification. In the molten state, the 0.7 wt% (or 1.3 at.%) Cu is in solution with Sn. In solidification, the Cu becomes supersaturated and must come out (most of them precip- 

---