Pad Hardness, Youngs Modulus, Stiffness, and Thickness Effects

3 Pad Hardness, Young s Modulus, Stiffness, and Thickness Effects Pad hardness has an influence on many aspects of polishing performance. A harder 

FIGURE 5.10 (a) Pad surface temperature profiles during the polishing time (s) of 200 mm blanket oxide wafers using a commercially available silica-based slurry, (b) Pad surface temperature profiles during the polishing time (s) of 300 mm blanket oxide wafers using a commercially available silica-based slurry. 

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