Pad groove effects

FIGURE 2.18 Temperature dependence of dynamic storage modulus for the samples with different groove orientation. 

During actual CMP process, on a macroscale, these effects may cancel out each other. However, the transient, microscale effects on CMP pad properties and hence material removal are not yet clear and need to be further studied. 

5 Pad-Wafer Contact and Slurry Transport Dual Emission Laser Induced Fluorescence 

FIGURE 2.19 The coefficient of friction at (a) 60 RPM and (b) 5 RPM, measured using DELIF technique, show no correlation with instantaneous fluid film thickness. 

FIGURE 2.21 (a) Wafer-etch geometry, (b) An image of the slurry layer between a patterned wafer and a Fruedenburg FX9 polishing pad. 

---

Pad Groove Effects Most polishing pads have grooves on their surface. Grooves on polishing pad surfaces have many important functions [1,2] ... 

---