Novel surface treatments surfaces

In the present study, a novel surface treatment of microporous carbon, so-called electro copper plating which has been used in the application fields is provided to introduce copper onto activated carbons. And, the catalytic reduction mechanisms of NO over ACFs/Cu prepared by electrolytic copper plating have been studied. 

Novel surface treatments for high performance textiles... 

Novel surface treatments for high performance textiles 79 (a) (b)... 

Lowther, S. E., Park, C., St. Clair, T. L. (1999). A novel surface treatment for titanium alloys, 22nd Annual Meeting of the Adhesion Society, Florida. 

Surface Modification. Plasma surface modification can include surface cleaning, surface activation, heat treatments, and plasma polymerization. Surface cleaning and surface activation are usually performed for enhanced joining of materials (see Metal SURFACE TREATMENTS). Plasma heat treatments are not, however, limited to high temperature equiUbrium plasmas on metals. Heat treatments of organic materials are also possible. Plasma polymerization crosses the boundaries between surface modification and materials production by producing materials often not available by any other method. In many cases these new materials can be appHed directly to a substrate, thus modifying the substrate in a novel way. 

We have recently modified the Krause process by incorporating a heat treatment step which results in a novel process for surface texturing of Kapton polyimide (Somasiri, N. L. D. Speckhard, T. A. U. S. Patent Applied For). When the textured polyimide is subsequently metallized, again using the Krause process, good adhesion is obtained after exposure to the solder float test. 

Filled polymer melts show diverse behavior that can include rheology typical of unfilled melts, rheology typical of dense suspensions, and novel thixotropic behavior and sensitivity to particle surface treatment. 

L. D. Eske and D. W. Galipeau, Characterization of SiOi surface treatments using AFM contact angles and a novel dewpoint technique. Colloids Surf. A154, 33, 1999. 

Sun et al. (2006) examined the use of novel silica nanofillers in underfill for flip-chip applications, and showed that pre-cure rheology and post-cure values of Tg are effected by nanosilica surface treatment. 

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