Multilayered chip inductors

FIGURE 6.1.19 Schematic models of representative multilayer ferrite chip components (Multilayer chip inductor, Multilayer LC hlter, and Multilayer hybrid component). 

Penchal Reddy M, Madhuri W, Balakrishnaiah G, Ramamanohar Reddy N, Siva Kumar KV, Murthy VRK, Ramakrishna Reddy, R. Microwave sintering of iron deficient Ni-Cu-Zn ferrites for multilayer chip inductors. Current Applied Physics 2011 11 191-8. 

FIGURE 6.1.18 Printing method for multilayer ferrite chip inductor. 

Ceramic and ferrite components such as multilayer ceramic capacitors, chip resistors, and chip inductors are generally terminated with a fired-on silver or silver palladium paste. Because silver dissolves easily into molten Sn-Pb solder, a Ni/Sn or Ni/Au overplate is recommended. 

M. Fujimoto, N. Narita, H. Takahashi, M. Nakazawa, Y. Kamiyama, and S. Sekiguchi, Miniaturization of Chip Inductors using Multilayer Technology and Its Application as Chip Components for High Frequency Power Modules, Industrial Ceramics, 12, (2001), pp. 26-28. 

Multilayer technology is exploited just as for multilayer capacitors (see Section 5.4.3) to EIA size specifications, and inductor chips can be bandoliered ready for surface mounting, typical inductance values lying in the range 1 nH to about 20 /rH. They find important applications as EMI suppressors as well as for a wide range of applications as a lumped circuit component in equipment of all types -communications, entertainment , computers, etc. (see Fig. 9.17). 

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