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Multichip stacking

Multichip stacking. Several IC chips are assembled using MCM techniques and the layers are stacked similarly to package stacking. Layer-to-layer interconnects are produced using an interposer such as fuzz button layers that differentiate this approach from the package-stacking approach. [Pg.322]

Chien D, Hellmold S, Yee M, Kilbuck K. Stacked multichip CSP standards a push forward. Adv Packaging. Jun/Jul. 2000. [Pg.33]

W. Minehan, W. Weidner, R. Jensen, R. Spielbelberger, and W. Jacobsen, Fabrication, Assembly, and Characterization of Stacked Multichip Modules Using Hot Pressed, Co-fired Aluminum Nitride, Int. J. Microcircuits and Electronic Packaging, vol. 17, no. 4, 4th quarter 1994. [Pg.62]

See other pages where Multichip stacking is mentioned: [Pg.217]    [Pg.254]    [Pg.320]    [Pg.75]    [Pg.75]    [Pg.76]    [Pg.217]    [Pg.254]    [Pg.320]    [Pg.75]    [Pg.75]    [Pg.76]    [Pg.478]    [Pg.432]    [Pg.433]    [Pg.8]    [Pg.254]    [Pg.259]    [Pg.173]    [Pg.8]    [Pg.36]    [Pg.9]    [Pg.37]    [Pg.291]   
See also in sourсe #XX -- [ Pg.320 ]



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