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Multichip package required materials

Iwami C, Licari JJ, Nakagawa C. New Adhesive requirements for multichip modules, Proc. 5th Inti. SAMPE Electronic Materials and Processes Conf. Los Angeles Jun 1991. Harper PR. Thermoplastic die attach for hermetic packaging. Inti. J. Microelectronics and Electronic Packaging. 4th Quarter 1994 17(4). [Pg.216]

See other pages where Multichip package required materials is mentioned: [Pg.474]    [Pg.475]    [Pg.484]    [Pg.139]    [Pg.187]    [Pg.187]    [Pg.187]    [Pg.438]   
See also in sourсe #XX -- [ Pg.443 ]



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