Multichip modules, application polyimides

Structuring of polymers today is industrially used for the production of nozzles for inkjet printers [19] and to prepare via holes in multichip modules through polyimide (PI) by IBM [20], as well as for many other applications, for example, fabrication of microoptical devices [21] and microfluidic channels [22-25],... 

The major applications of LCP films in electronics are multilayer boards and multichip modules, and flexible printed circuits. Current materials used in the.se applications include polyimide film, high performance thermoplastic film such as polyphenylene sulfide and polyetherether ketone, and fiber reinforced composites such as quartz fiber-polyimide. The price of these materials for electronic packaging is in the range of. 50 to. l(K)/lb, so LCPs can compete very effectively at their current prices. Based on a two to three times increase in price... 

Figure 30 Main applications of adhesives in electronic and semiconductor industries (a) polyimide interlayer dielectric films in the fabrication of integrated circuits (b) die attachment in plastic packages (c) die attachment in ceramic packages (d) multichip module with flip chip and surface-mounted devices (e) flexible circuitry (f) tape automated bonding (g) liquid crystal display panels.

Another application is a 3-D CSP multichip module that is based on a thin flexible PCB (Fig. 26). Due to improvements in the PCB manufacturing process, especially with regard to flex-polyimide and its metallization, a high-quality, bondable chip carrier was developed from which a compact electronic module was created with an optimal density within the three spatial dimensions. This packaging concept is used to produce electronic modules for hearing aids [123]. 

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