Microlithography, deep

The radiation sources employed in microlithography include conventional (>300 nm) and deep-UV (<300 nm) light, electron-beam, ion-beam and x-ray sources. By far the predominant lithographic technology is conventional photolithography which... 

Dubroeucz, G. M. Zahorsky, D. "KrF Excimer Laser as a Future Deep UV Source for Projection Printing," International Conference on Microlithography, Grenoble, France, Oct. 1982. 

Firtion, V. A. Jewell, T. E. Wilcomb, B. E. Clemens, J. T. Excimer Laser-Based Lithography A Deep Ultraviolet Wafer Stepper SPIE Conf. on Microlithography, March 13, 1986. 

Recent progress has been made in microelectronic device fabrication, particularly in microlithography used to manufacture the high-resolution circuit elements of integrated circuit (Ref. 96). Deep-UV photolithography based on chemically amplified resist is likely to be the first technology that met the severe performance criteria required. The best known chemically amplified resist is based on poly (4-t-butoxycarbonyloxy styrene) or copolymers (Ref. 97). 

Allen, R. D. Conley W. E., Kunz, R. R. Deep UVResist Technology, Chapter 4 in Handbook of Microlithography, Ed. P. Rai-Choudhury, SPIE Optical Engineering Press, Bellingham, WA, 1997. 

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