Metal-bonded diamond grinding wheels

Most of the high-efficiency grinding experiments were conducted on a vertical machining center. A straight metal-bonded diamond grinding wheel was inserted into the machine spindle. The electrolysis occurs on... 

Suzuki, K., Uematsu, T., Yanase, T., and Nakagawa, T., "On-Machine Electrodischarge Truing for Metal Bond Diamond Grinding Wheels for Ceramics," Proceedings of the International Conference on Machining of Advanced Materials, NIST 847, July 1993, pp. 83-88. 

Qian, J., Li, W., and Ohmori, H., Precision internal grinding with metal-bonded diamond grinding wheel. Journal cf Materials Processing Technology, Vol. 105, 2000b, pp. 80-86. 

Graphite, PCD, metal-bonded cBN, and diamond grinding wheels... 

This chapter introduces that the coarse 140-mesh diamond wheel can be used for ultra-smoothness grinding of fine ceramics. First of all, we discuss that ductile-mode grinding of fine ceramics with the coarse 140-mesh metal-bonded diamond wheel is possible because of the experimental relationship between the table speed and the groimd workpiece smiace. Second, the influence of the speed of the wheel and the workpiece material on ductile-mode grinding is explained. Finally, the newly developed ductile-mode ultra-smoothness grinding method with coarse-grain-size wheel, in which the resultant smiace roughness is below about 10 ran (P-V) and 1 nm (RMS), is introduced. 

Ductile-mode grinding of fine ceramics with the coarse 140-mesh metal-bonded diamond wheel has been shown to be possible in plunge surface grinding. It is estimated that the thermal effect due to the large wear land of the cutting edge on the 140-mesh wheel surface has considerable effect on... 

Yasui, H. and Sawa, T., Influence of fluid supply on ultra-smoothness grinding of silicon nitride ceramic with 140 metal bond diamond wheel. Proceedings of the ASPE 19th Annual Meeting, 2003, 565. 

The use of metal bonds is reserved for the most difficult grinding operations, where maximum strength, durability, and thermal resistance is required and exotic abrasives such as diamond are justified as the abrasive. Most of this is fixed feed operation. Metal bonded cutoff wheels, represented by metal bonded diamond segments brazed to the periphery of a... 

When silicon was ground together with tungsten carbide, the surface roughness improved when compared with grinding the silicon alone brittle-to-ductile transition was observed for JIS 4000 mesh size wheel. In a later study (Itoh et al., 1998), silicon and glass (BK7) were ELID lapped with metal resin diamond-bonded wheels of grit sizes of JIS 8000, JIS 120,000, and JIS 3,000,000. 

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