Mechanical polishing, definition

Also, Cj/jr 0.0130 and n = 1.0 for the boiling of water on a mechanically polished stairilcss steel surface (Table 10-3). Note that vie expressed the proper ties in ilnifs specified under Eq. 10 2 in connection v/ith their definitions In order to dvoid unit manipulations. 

By its virtue, chemical mechanical planarization (CMP) is a subtractive manufacturing process that polishes off overburden material as exemplified in Figure 17.3. So, naturally, once finished, it will reveal all the feamres underneath, circuits and defects alike. Also, in the semiconductor process flow, CMP is usually the terminal downstream process that completes the definition of a device or circuit. As a consequence, not only does it generate defects of its own, but it can also modulate defects from upstream processes. Therefore, the post-CMP defect target is usually the most stringent along the entire process flow because at this stage, defects have the most direct impacts on yield and reliability. 

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