Mechanical drilling

Hew -H/ffer Christensen Jar. (See Figure 4-173 [57A].) This is a mechanical drilling jar with firing racks system applied. Its jar force is constant regardless of torque applied. 

Figure 4-173. Hevi-Hitter mechanical drilling jar. (Courtesy Hughes Christensen.)...

Electrochemical drilling (ECD) is an important application of ECM. The ECD operations enable the production of not only round holes, as in the case of mechanical drilling, but also shaped holes with oval, rectangular, triangular, and other sections to drill several tens of holes of varying diameters and/or shapes simultaneously to produce curved holes or slots, for example, ports and passages in manifolds to produce holes that are not perpendicular to the surface, and to... 

The many applications of petroleum have been known from ancient times. Initially, primitive ways were employed in petroleum operations. Examples include collecting petroleum from the ground surface and the processing of oil sands. The development of the petroleum industry started when mechanical drilling for oil wells for petroleum production was employed in 1859 in the USA. Practically all petroleum extracted in the world now makes use of mechanical drilling. 

In 1859, the former railway conductor E. Drake drilled the first oil well for petroleum extraction. This was the first known oil well in the world that used mechanical drilling. The method was so simple and effective that, shortly after it was introduced, it was employed by many companies. The major reason was that it could extract a large amount of petroleum in a less expensive manner. 

In TSV, vertical micro through holes (vias) are chemically etched, mechanically drilled or laser drilled in the silicon die at the wafer level, then made electrically conductive by plating or vapor depositing metal conductors. The sidewalls of the vias, however, must first be insulated from the silicon. A dielectric film overlaid with conductive metal may be applied to the sidewalls or the exposed silicon may first be oxidized to isolate it from subsequent metallization. Connections within the chips are generally made between bond pads on one face of the die to a land on the opposite side. 

A global analysis of all radionuclides, as well as of non-radioactive constituents, can be performed by taking microsamples from the fuel pellet, e. g. by mechanical drilling or by an ultrasonic technique. By using sophisticated sampling techniques, a local resolution on the order of 300 pm is possible. In order to determine the fission gas contents, the microsamples are dissolved under vacuum in de-aerated nitric acid the released gases are collected and analyzed by mass spectrometry. Other constituents are determined by an appropriate separation and measurement method as an example, determination of in such microsamples by neutron activation analysis is described in Section 3.2.3.3. 

Drill information (especially through drills and mechanical drills)... 

This generation of printed boards is characterized by very small blind, buried, and through vias made by techniques other than mechanical drilling. To turn blind vias into buried vias, these process techniques are repeated and the layers are built up, hence the name build-up ox sequential build-up circuits (SBU). 

Manufacturing Process. The manufacturing process for a DYCOstrate PERL substrate utilizes common printed circuit board techniques. Only the via-generation process is different. To produce a plasma-etched via hole requires only two or three process steps that replace the conventional mechanical drilling-debur-desmear steps ... 

In this chapter, holes created by traditional mechanical drilling methods are referred to as drilled, and the process is referred to as drilling. Holes created by laser, plasma, or photoimaging are not really drilled, even though the term is often used to describe them. When this chapter references nonmechanical via-hole creation processes, these are referred to by their specific type. 

Aspect ratio determination If the via to be formed is more than 0.016 in. (6.3 mm) deep, it is better to use a mechanical drilling process. 

The following are factors to be considered regarding mechanical drilling. 

Microvias that are created by laser drilhng can be located at a reduced pitch for CAF studies because one does not expect drill damage from a laser-ablated hole and it will not be subjected to the drill wander of a mechanically drilled hole. Thus, laser drill tolerances are below 0.025 mm (0.001 in.). 

FIGURE 6Z8 Microvia capabilities shown by base thickness and hole diameter. Also shown is the range of technologies from HDI to mechanical drilling required to create the vias. 

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