Loss of Adhesion Delamination

Loss of adhesion or loss of mechanical strength may result from cohesive failure within the adhesive or adhesive failure at the bondline interfaces, such as between the adhesive and the substrate or the adhesive and the device. Adhesion failures result in delamination or separation of ICs, substrates, packaged devices, heat sinks, or other attached parts. It is important that the mechanieal strength of adhesives be maintained over the operational lifetimes of the bonded parts and at elevated temperatures or other environmental conditions. 

Delamination may be complete or partial. Complete de lamination results in gross separation of the device, substrate, or other adherend. Partial debonding can result in device or substrate cracking with complete detachment occurring in time. Numerous factors and mechanisms contribute to delamination, some of which are  

Of these failure mechanisms, the major ones associated with delamination include contaminated surfaces, inadequate adhesive coverage, stresses, voids, and moisture absorption. Many of these mechanisms are also responsible for other failure modes besides delamination. 

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