Lithographers/ lithography

You are to optimize the thickness of resist used in a production lithographic process. There are a number of competing effects in lithography. 

In this paper, the material characteristics and lithographic evaluation of this new resist are demonstrated. The resist meets the requirements for KrF excimer laser lithography, which exhibits high sensitivity, high resolution and high aspect ratio pattern profiles. 

Nealey and coworkers [75,76,146] took a similar approach and applied lithographically defined self-assembled monolayers as substrates to direct the orientation of block copolymer thin films. After EUV interferometic lithography on octadecyltrichlorosilane (OTS) or phenylethyltrichlorosilane (PETS) monolayers, PS-fr-PMMA block copolymers were deposited and annealed on the substrates. Due to the selective wetting of PS and PMMA on the unexposed and exposed regions, respectively, they were able to obtain large areas of perpendicular lamella when the commensurate condition was fulfilled. 

The photoresponsive properties of molecular glasses also have been applied in the design of resists for semiconductor lithography. In a resist, irradiation changes the solubility of the materials, making it more or less soluble (positive or negative resist, respectively). The search for new resist materials follows the development of lithographic techniques toward deep-UV and electron beam... 

The three-dimensional circuit elements are fabricated by a series of processes collectively known as lithography . The pattern is first generated in a polymeric film on a device wafer and this pattern is then transferred via etching, into the underlying thin film. The purpose of this book is to review the theory, materials, and processes that are used in the lithographic process. This book is intended to be a tutorial and not a comprehensive review. Each chapter contains many references to which the reader can refer for more detail on any specific aspect of microlithography. 

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