Lead-free soldering Reliability, affect

The discussion in the previous section makes it clear that there are significant differences between lead-free, tin-based solder systems and other solders successfully used in the past. The anomalous crystal structure and allotropic transformations in tin-based alloys can affect the material properties that control the ultimate performance and reliability of these solders in microelectronic assemblies. Table 5 provides a comparison of several solder systems including high-lead and eutectic tin-lead alloys, white and gray tin, a lead-indium solder, gold-tin eutectic, and a fictitious ideal alloy. 

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