Lead-free cleaning process changes

With the move to lead-free solder pastes, problems in the cleaning and removal of flux residues from soldered assemblies are to be expected due to soldering-process variations. Because of the change of flux formulations, especially with respect to new components or changes in solvents used, resin, and thixotropic concentrations, the removal of unsoldered solder paste also may be affected. The lead-free pastes used in this study were tested additionally for the ease of removal from stencils and misprinted circuit boards. 

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