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Unsoldered solder paste

Stencil and Misprint Cleaning Removing Unsoldered Solder Paste... [Pg.81]

With the move to lead-free solder pastes, problems in the cleaning and removal of flux residues from soldered assemblies are to be expected due to soldering-process variations. Because of the change of flux formulations, especially with respect to new components or changes in solvents used, resin, and thixotropic concentrations, the removal of unsoldered solder paste also may be affected. The lead-free pastes used in this study were tested additionally for the ease of removal from stencils and misprinted circuit boards. [Pg.81]

Unsoldered Lead-Free Solder Paste Cleaning Results... [Pg.81]


See other pages where Unsoldered solder paste is mentioned: [Pg.900]    [Pg.900]    [Pg.370]    [Pg.900]    [Pg.900]    [Pg.370]    [Pg.1048]   
See also in sourсe #XX -- [ Pg.81 ]




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