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Large scale integrated multilevel

Polyimide for Multilevel Very Large-Scale Integration (VLSI)... [Pg.93]

Development of Polyimide Isoindoloquinazoline-dione in Multilevel Interconnections for Large-Scale Integration (LSI)... [Pg.123]

Prior to the introduction of Cu electroplating, the primary method used to form a multilevel structure of interconnections in integrated circuit applications was A1 and Al-alloy metallization.49 Localized porous-type anodization was developed in the 1970s to obtain planar interconnection metallization for multilevel large-scale integration (LSI) 26,46,50 For example, Schwartz and Platter showed that the subtractive etching for A1 interconnects could be substituted... [Pg.232]

Ssmiconductors. The distinctive conformahty of parylene is often regarded as a handicap for meeting the requirements of an interlayer dielectric (ILD) in large-scale integration (LSI) multilevel interconnection systems. After many... [Pg.9400]

Aleisa, E. (2005). Multilevel Integration of Simulation and Facilities Planning for Large-Scale Systems. Department of Industrial Engineering. Buffalo, NY, The State University of New York at Buffalo. VoL, No. [Pg.69]

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Integral scale

Large scale integration

Multilevel

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