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Integration/fabrication after polymerization

Integration/fabrication after polymerization Solution processable CEPs Melt-processable CEPs... [Pg.9]

Polymer thick films also perform conductor, resistor, and dielectric functions, but here the polymeric resins remain an integral part after curing. Owing to the relatively low (120—165°C) processing temperatures, both plastic and ceramic substrates can be used, leading to overall low costs in materials and fabrication. A common conductive composition for flexible membrane switches in touch keyboards uses fine silver particles in a thermoplastic or thermoset polymeric binder. [Pg.126]

See other pages where Integration/fabrication after polymerization is mentioned: [Pg.231]    [Pg.212]    [Pg.231]    [Pg.212]    [Pg.231]    [Pg.212]    [Pg.193]    [Pg.39]    [Pg.155]    [Pg.42]    [Pg.474]    [Pg.1474]    [Pg.91]    [Pg.646]    [Pg.74]    [Pg.648]    [Pg.649]    [Pg.352]    [Pg.607]    [Pg.624]    [Pg.417]    [Pg.624]    [Pg.1387]   
See also in sourсe #XX -- [ Pg.231 ]



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Integrated fabrication

Polymeric fabrication

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