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High-performance packaging electrical requirements

Typically, epoxy is added to BT resins to modify the properties of pure BT. Therefore these materials are also considered epoxy blends. BT/epoxies normally have Tg values in the range of 180°C to 220°C and exhibit a good combination of electrical, thermal and chemical resistance properties. BT/epoxy is commonly nsed in BGA substrates and chip scale packages since it can meet the requirements of specifications for use in semiconductor chip packaging. It is also suitable for high-density multilayers requiring good thermal, electrical, and chemical performance. [Pg.144]

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