Hexamethylene tetraamine

Copolymers of methacrylic add and ethylene termed as ethylene ionomers have been used as the base polymer for binding alkali, alkaline earth and transition metal ions. Organic amines such as n-hexylamine, hexamethylene tetraamine, 2,2,6,6-tetramethyM-hydroxy piperazine, ethylene diamine and polymeric diamines such as silicone diamine, polyether diamine and polymeric diamines such as silicone diamine, polyether diamine and polyamide oligomers considerably enhance the complex formation characteristics of Zn(II) ethylene ionomers thereby enhancing the physico-chemical properties [13]. 

Binders for copper clad laminates consist of a solution of phenolic resol (part A) and of a composition obtained from a drying oil modified resol, hexamethylene-tetraamine and BPA/DC monomer or prepolymer [142, 143]. 

Rare earths EDTA Erichrome black T Hexamethylene tetraamine buffer [114]... 

Phenolic materials go back to the patents of Baekeland and are based upon the reaction of phenol and formaldehyde to yield a lower molecular weight resinous material that can be formulated with other resins and sometimes other curatives to yield a paste adhesive or a film adhesive. When phenol and formaldehyde are reacted in the presence of an acidic catalyst with an excess of phenol versus formaldehyde, they yield what are known as novolac resins. These materials are soluble in organic solvents and do not react further with themselves thus, they need to have a curative added. That curative is most often hexamethylene tetraamine. Another type of phenolic resin can be generated with an excess of formaldehyde and under basic conditions. These materials, known as resole phenolics, will react with themselves to yield a ftilly cured phenolic and thus must be stored frozen in order to limit this reaction. Thus, resole phenolics do not need an external CTOsslinker. Resole phenolics are widely used in the binding of paper products and the bonding of wood. Adhesives based upon these materials were brittle and could only be used to bond wood, where it is still widely used. A more widely usable adhesive was developed during World War II which modified the very brittle phenolic adhesive with poly(vinyl formal) resins. These materials were... 

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