Groove profile

In the second type (ISO-K), the flanges have a grooved profile, and the connections are realized by claw clamps (see Fig. 1.21). The number of clamps depends on the dimensions of the flange. The standard dimensions for this type of flange are from 63 to 500 mm of internal diameter (DN63-DN500). 

Figure 10.12. (a) Uniform deposition thickness in a groove after a time q (b) evolution of a groove profile during deposition, resulting in geometric leveling. 

The average chemical potential reduction (driving force) per atom for decay of the grooved profile we have considered is the order of Ap=yD/h, where Q is the atomic volume. The decay rate we have calculated is very non-linear in Ap (e.g. it decreases exponentially with h) and contrasts markedly with theories" based on a linear dependence of the decay rate on Ap. 

Rettori and Villain (1988), and Langon and Villain (1990) have written down equations of motion for the one-dimensional groove profile in both discrete and continuous forms. In the discrete form, the variables are the average positions x , t) of step n in the step train leading from the top to bottom of the groove (or vice versa). In the continuous form, the surface profile is specified by a height function h(x, t). The equation for h(x,t) can be obtained from the equations for x (0 by taking a suitable continuum limit. 

Figure 8 Amplitude of the groove profile against t for Z, = 90a. The lifetime of the top terrace t can be determined from the local slope of the curve through interpolation.

Figure 10 Groove profiles obtained from numerical integration of Eq. (31). The dashed line is the data, from the simulation. Times are proportionally scaled to make the profiles to correspond to those shown in Eig. 7, escept the topmost one at i = 0 and the bottom-most one at twice the time of the one above.

Fig. 9. (a) Groove depth evolution curves, (b) Groove width evolution curves. When free evaporation and surface diffusion are considered simultaneously, the groove profile evolution increases more slowly and tends asymptotically to a constant value (108). 

Figure 10.15. True leveling on a V-groove produced by a nonuniform current distribution, i r > /, in the presence of a leveling agent (a) nonuniform current density and deposit thickness, hs and hf, after time t = 1 (b) evolution of a groove profile during deposition. Activation control.

Dukovic and Tobias [58] performed a simulation of leveling in a V groove profiles for Watts nickel plating with added coumarin, as investigated experimentally by Kruglikov et al. [59]. It was reasoned that inhibitors described by the diffusion theory of leveling [60, 61] could be assumed to operate under diffusion control and that the overpotential should be a function of current density md inhibitor flux. A... 

One can see that T G (tongue and groove) profile shown in Figure 6.2 had much lower density than a maximum one. Overall porosity was accounted for 13% of the material volume. The main reason was that the profile shown in Figure 6.2 was obtained without added antioxidants. The material was rather quickly oxidized in an airflow oven, in a weathering box, and on actual decks, particularly in the South. The highest compaction of the material was in the tongue d = 1.085 g/cm ), but an overall... 

Figure 15.6 A hollow die, or a spider die with a fixed mandrel as an integrate part of the die to make the tongue-and-groove profile (see Fig. 15.2).

Comparison of experimental groove profiles with the theoretical curves has been used both to verify Mullins theory and to show the grooving... 

Chip-forms, Chip Breakabiiity and Chip Control, Fig. 19 Predicted chip breakabiiity for a specified grooved tool insert based on 2D chip-groove profile obtained from a 3D image of the tool insert (Jawahir et al. 2000)... 

In conjunction with this fuzzy logic approach, a new chip-groove classification system was proposed, and the most significant geometric chip-groove parameters were identified from chip-groove profiles. A fuzzy rule-based system was developed based on the composite profile of the tool insert and its chip breakabiiity performance. 

Figure 19 shows the predicted chip breakability for a given cutting tool insert in machining of AISI 1045 steel, based on a 2D cross-sectional chip-groove profile obtained from a 3D image of the cutting tool insert. 

The geometry of Grinding Wheels ranges from plain cylindrical to complex grooved profiles (DIN ISO 525). The materials of the bond and the abrasive grains for both Grinding Wheel types wiU be outlined in detail below. 

Answer We did not see anything that looked like a second phase in any of the boundaries. However, in some studies of the Morganite material at about 1800°C the groove profile showed a hump, as if something was being extruded out of the boundary. This was not very reproducible. This may indicate that the material in the boundary is softer than the rest of the crystals. But this softer material did not appear to be a second phase. 

For the one-component case Mullins ( ) has shown that the distance IF between the maxima of the groove profile may be expressed in terms of the isothermal annealing time t as... 

Yoshida and coworkers discuss densification of glasses caused by indentation [8]. Now consider the finding Bhushan e.a. [9] that microhardness measurements of worn metal samples show a 10-80 % increase of hardness in the worn layer. While behavior of the metals is different from that of polymers since the latter are viscoelastic, a possible connection between the characteristics of groove profiles we have obtained with hardness determination seemed worth pursuing. 

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