Silver-gold alloy films

Ibanez FJ, Zamborini FP (2008) Chemiresistive sensing of volatile organic compounds with films of surfactant-stabilized gold and gold-silver alloy nanoparticles. ACS Nano 2(8) 1543-1552... 

Electronic Applications. The PGMs have a number of important and diverse appHcations in the electronics industry (30). The most widely used are palladium and mthenium. Palladium or palladium—silver thick-film pastes are used in multilayer ceramic capacitors and conductor inks for hybrid integrated circuits (qv). In multilayer ceramic capacitors, the termination electrodes are silver or a silver-rich Pd—Ag alloy. The internal electrodes use a palladium-rich Pd—Ag alloy. Palladium salts are increasingly used to plate edge connectors and lead frames of semiconductors (qv), as a cost-effective alternative to gold. In 1994, 45% of total mthenium demand was for use in mthenium oxide resistor pastes (see Electrical connectors). 

Other metals, such as copper, nickel, or silver, have been used as electrode materials in connection with specific applications, such as the detection of amino acids or carbohydrates in alkaline media (copper and nickel) and cyanide or sulfur compounds (silver). Unlike platinum or gold electrodes, these electrodes offer a stable response for carbohydrates at constant potentials, through the formation of high-valence oxyhydroxide species formed in situ on the surface and believed to act as redox mediators (40,41). Bismuth film electrodes (preplated or in situ plated ones) have been shown to be an attractive alternative to mercury films used for stripping voltammetry of trace metals (42,43). Alloy electrodes (e.g., platinum-ruthenium, nickel-titanium) are also being used for addressing adsorption or corrosion effects of one of their components. The bifunctional catalytic mechanism of alloy electrodes (such as Pt-Ru or Pt-Sn ones) has been particularly useful for fuel cell applications (44). 

Thin films of thickness typically 10 nm are readily formed in a vacuum chamber by evaporation, sputtering , or chemical vapour deposition (CVD). Many metals and metal alloys, e.g. aluminium, silver, gold and Ni-Cr, can be... 

Another important problem is the elimination of the chemical interactions between contacting phases and also of the diffusion of metal atoms into the oxide bulk [487 89], One example is the operation of commonly used indium junctions, which are convenient because films of this soft metal and its alloys can be applied mechanically [490], This fact stimulates the quest for low-temperature techniques for junction fabrication. It is known that silver, gold, and copper, and also probably platinum [202] and palladium [487], are most suitable because of their weak interaction with HTSCs. 

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