Film stress and substrate curvature

Although highly sophisticated experimental tools for measuring the 

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The in-plane extensional strain and curvature in the film-substrate system arises as a consequence of thermal expansion mismatch between the film and substrate materials during temperature excursion from the reference temperature. Conditions are assumed to be such that the temperature is uniform throughout the film and substrate at all times during thermal cycling. Some particular temperatures at which distinct transitions occur in the elastoplastic deformation of the film material are first identified by adopting the assumption that, over the range of temperature, the properties of the film and substrate materials remain essentially unchanged effects of temperature dependence of plastic yield or flow behavior on the evolution of film stress and substrate curvature are examined subsequently. 

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