Film deposition methods, summary

After the precursor stock solution is prepared, various techniques can be used to coat the substrate, depending on the solution viscosity, required film thickness and coverage. The most common methods in the semiconductor industry are spin- and dip-coating. Other processes that are used for deposition include spray coating and stamping. A summary of the uses, limitations, and advantages of the various thin film deposition methods is reported in Table 2.2. 

In summary, common thin film deposition technologies for surface modification and the engineering of biomaterials have been reviewed with an emphasis on the fundamentals and technology of each method. Examples of fabricated films and their applications in the biomedical fields are described. Properties such as film thickness, mechanical properties, and surface chemistry produced by different techniques can differ greatly and the choice requires systematic study and comparison. From the perspective of the development of thin film deposition techniques, the combination of the different techniques, chemical and physical, can realistically enable the exploration and expansion of existing techniques for the fabrication of future films and coatings. 

The complex impedance spectroscopy (CIS) technique has been extensively used in recent years to examine electrochemical characteristics of surface-deposited electroactive polymer films. A useful summary of the fundamental principles is found in the monograph by McDonald. Applying impedance methods to electroactive polymers has recently been reviewed by Musiani. ... 

Rare-earth oxide films have also been applied by sputtering (Hussey et al. 1989, Graham 1991) and physical vapour deposition (PVD) routes (Adams et al. 1987, Onay and Saito 1990). For a detailed summary and history of methods used, see Moon and Beimett (1989). 

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