Film buckling, bulging and peeling

Interface delamination and film fracture induced by residual stress in the thin film were the focus of discussion in the preceding chapter where models were developed within the framework of linear elastic fracture mechanics. Such analyses did not account for the actual separation of the film from its substrate. However, there are delamination processes for which transverse deflection of the film away from the substrate becomes an important consideration in a variety of practical applications. Examples include [Pg.341]

This chapter deals with the transverse or out-of-plane deflection of a thin film, and it includes quantitative descriptions of the phenomena associated with the buckling, bulging or peeling of a film from its substrate. A common thread throughout the discussion is that system behavior extends beyond the range of geometrically linear deformation. Consequently, aspects of finite or nonlinear deformation must be incorporated to capture essential features of behavior. The progression of delamination associated with trans- [Pg.341]

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