Exposure technology

K. H. Brown, Proc. Soc. Photo-Opt. Instr. Eng. 2438, 33 (1995). A good source of information on the new exposure technologies can be found in the Proceedings of the International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication, pubhshed annuaUy in Issue 6 of the Journal of Vacuum Science and Technology B. 

Lithium titanate, 15 142 Lithium trifluoromethanesulfonate, in lithium cells, 3 459 Lithiun tetrafluoroaluminate, 2 379 Lithographic resist exposure technologies future, 15 186-191 Lithographic resists, 15 154-201 essential attributes of, 15 154-156 extension to the nanoscale, 15 181-191 historical development of resist materials, 15 156-160... 

There is a variety of exposure technologies, each with a fundamental resolution limit resulting from radiation interactions with both the hardware and the resist. From a practical standpoint, factors such as alignment tolerance and resist swelling usually degrade resolution to a point where minimum feature sizes are larger than theoretically expected. Nevertheless, examining the fundamental resolution limits of the various techniques can be instructive. 

Resist requirements for microfabrication are similar, regardless of the exposure technology. While the general requirements have been discussed in many articles (2,3) it is instructive here to review the more important requirements, particularly in view of the special limitations imposed by the need to fabricate fine line VLSI devices. 

Dorato, M. A., and Wolff, R. K. (1991). Inhalation exposure technology, dosimetry, and regulatory issues. Toxicol Pathol 19(4 Pt 1), 373-383. 

TABLE 57.1. Major polymer platforms for the evolving exposure technologies. 

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