Evaporation rate during coating

Step coverage — From the process flow schematics shown previously, it is apparent that printed transistors inherently have substantial topology within their cross-sectional structure. As a consequence, step coverage becomes an important parameter in process optimization. Given the large steps (typically several tens of nm or more) and the use of relatively thin subsequent layers, it is important that the layers cover each other adequately liquids must be able to coat the vertical sidewaUs of steps during a multilayer print process. This places constraints on fluid viscosity, evaporation rate, wetting, etc. 

Evaporation characteristics in surface coatings the evaporation rate is of importance during various application stages. During the evaporation process the solute should not precipitate from the solvent blend, the composition of the system should remain balanced . Air humidity should also be taken into consideration. After drying as little as possible solvent should remain in the solute and no negative effects should be present in the formed film. 

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