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Eutectic systems microstructure development

Other lead-free solder alloys which have been developed and evaluated by fee industry include Sn-Ag, Sn-Ag-Bi, Sn-Bi-In, and other ternary and quaternary alloys (Ref 24-33). The use of alloys containing indium (In) may be limited due to fee scarcity of indium and its high cost. The eutectic Sn-Ag alloy (melting temperature 221 °C, or 429 °F) was qualified for automotive applications in fee 1990s on ceramic thick film substrates and PWBs (Ref 3,12-15,34- 5). The microstructural characteristics of the Sn-Ag-Cu system under different reflow conditions and... [Pg.4]


See other pages where Eutectic systems microstructure development is mentioned: [Pg.430]    [Pg.175]    [Pg.175]    [Pg.221]    [Pg.395]    [Pg.455]    [Pg.35]    [Pg.323]    [Pg.795]    [Pg.457]   
See also in sourсe #XX -- [ Pg.318 , Pg.319 , Pg.320 , Pg.321 , Pg.322 , Pg.323 , Pg.324 ]




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Eutectic

Eutectic system

Microstructural development

Microstructure development

Microstructure eutectic

System Development

Systems developed

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