Epoxy resin Nanoclay based

Qi Qi, B., Zhang, Q. X., Bannister, M., Mai, Y.-W. Investigation of the mechanical properties of DGEBA-based epoxy resin with nanoclay additives. Compos. Struct. 75 (2006) 514—519. 

The inks are prepared by mixing an epoxy resin (Epon 826 epoxy resin) with dimethyl methyl phosphonate, nanoclay platelets (Cloisite 30b), silicon carbide whiskers (SI-TUFF SC-050), and milled carbon fibers (Dialead K223HM). Further, an imidazole-based ionic liquid is employed as a latent curing agent (Basionics VS03) (31). 

The viscoelastic and thermal properties of fully and partially cured DGEBA epoxy resin composites were smdied modified with montmorillonite nanoclay exposed to UV radiation. Samples were fabricated and cured to 80 % conversion (partially cured) based on isothermal cure kinetic smdies. Influence of 1-3 wt% loading of montmorillonite nanoclay on the cure behavior and development of physical properties of these composites were evaluated. Results of the smdy revealed that for optimization of modified epoxy composite properties, a different curing cycle was necessary due to interaction of different amounts of nanoclay and epoxy molecules. Addition of nanoclay increased the viscoelastic properties, storage modulus and activation energy of decomposition of partially cured samples evolved over exposure time, while fuUy cured samples degraded over the same period. 

Zhou G, Movva S L and Lee J (2008), Nanoclay and long-fiber-reinforced composites based on epoxy and phenolic resins , J Appl Polym Sci, 108, 3720-3726. 

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