Epoxy polymer, haloid-containing

Kinetics of curing of a haloid containing diepoxide based on hexachlorobenzene has been studied. This oligomer (EPS-1) was cured by 4,4 -diaminodiphenylmethane (DDM) in the stochiometric ratio DDM EPS-1. Haloid containing epoxy polymer with conditional designation EPS-l/DDM has the chemical structure shown in Figure 10.1. 

Kozlov, G. V Bejev,A. A. Zaikov, G. E. The physical reasons for the homogeneous and nonhomogeneous reactions of haloid-containing epoxy polymer curing. J. Appl. Polymer Sci. 2003, 90(5), 1202-1205. 

Thus, the stated above results have demonstrated that both scaling Eq. (86) of Chapter 1 and fractal Eq. (27) of Chapter 1 (or Eq. (61) of Chapter 2) describe well to an equal extent haloid-containing epoxy polymer 2DPP+HCE/DDM curing reaction kinetics at different curing temperatures. In virtue of this circumstance there exists intercoimection between parameters included into the indicated equations. The fractal Eq. (61) of Chapter 2 introduces in the kinetics problem consideration reaction products structure (in the given case structure of microgels and condensed state after gel formation point), characterized by its fractal dimension D, that makes this conception physically more informative [34]. 

Let us consider the physical model application described above for the curing process treatment of a haloid-containing epoxy polymer (the system 2DPP-PHCE/ DDM) [37-39], It is obvious that in this case the relationships (Eq. (5) of Chapter 2) or (Eq. (7) of Chapter 2), corresponding to the reaction (Eq. (3) of Chapter 2), should be used. 

Dolbin, I. V Ligidov, M. Kh. Bejev, A. A. Kozlov, G. V. Homogeneous and non-homogeneous kinetics of curing of haloid-containing epoxy polymers. Theses of Reports of International conf Vital Problems of Modem Science . Part 3. Samara, 12-14 September 2000,26. 

Kozlov, G. V. Burya, A. 1. Scaling and fractal analysis of haloid-containing epoxy polymer curing. Composite Materials, 2008,2 (2), 31-35. 

Hence, the results stated above have shown accuracy in the scaling approach to the description of the curing reaction of the haloid-containing epoxy polymer. Application of the indicated concept allows elucidation of the physical aspects of this process and the main distinctions of real chemical reactions from those obtained by computer simulation. Up to the gel formation point spatial disorder, defined by the different intensities of diffusion of reagents at various curing temperatures, completely controls the curing reaction course. After the gel formation point, tightening cluster formation levels these distinctions [51]. 

---