Electroless fundamental aspects

Y. Okinaka and T. Osaka describe the fundamental aspects and technological applications of autocatalytic metal deposition processes. In view of that electroless deposition has found important applications in the manufacture of microelectronic devices, a review of the pertaning electrochemical fundamentals has been long overdue. 

Some Fundamental Aspects of Electroless Plating of Metals and Alloys... 

Fundamental and Practical Aspects of the Electroless Deposition Reaction... 

A number of books [10, 11] and book chapters [12-15] are available on the subject of electroless deposition. In this chapter, discussion will center on some of the fundamental and practical aspects of the electroless deposition process. Emphasis will be somewhat biased towards applications relevant to microelectronics. Electroless deposition on fine conductors, which are usually of smaller dimension than the dif-... 

O Sullivan describes the fundamental theory, mechanistic aspects and practical issues associated with autocatalytic electroless metal deposition processes. Current approaches for gaining fundamental understanding of this complex process are described, along with results for copper, nickel and various alloys. Emphasis is placed on microelectronic applications that include formation of structures that are smaller than the diffusion layer thickness which influences structure formation. 

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