Electroless DMAB reducing agent

Employing potential-pH and cyclic voltammetric characterization techniques, Burke and coworkers [48, 73] have advanced the notion that incipient surface hydrous oxide species mediate the electrooxidation reactions of reducing agents of interest to electroless deposition. Thus, in the case of electroless Ni-B, an interfacial, basic, cationic Ni(I) hydrous oxide species would mediate the oxidation of DMAB, as shown in part here ... 

Selective electroless nickel plating of particle arrays on polyelectrolyte multilayer was investigated for the potential applications in sensors, optoelectronics, and biochips.96 This process is based on the preparation of functional colloidal arrays on surfaces. In the next step metal deposition is carried out on the surfaces of the patterned particles secured on the substrate. Samples of colloidal arrays on patterned polyelectrolyte templates are first pretreated with a Pd(II)-based catalyst. After rinsing with deionized water and drying, samples were plated with nickel using dimethylamine borane (DMAB) as a reducing agent. Based on the results of this work,96 it was shown that the selective electroless nickel deposition on 3D patterned surfaces can be successful. 

Kim DH et al (1996) Electroless Ni-Fe-B alloy plating solution using DMAB as a reducing agent. Plat Surf Finish 83 78-80... 

Many metallic powders can be successfully deposited from aqueous solutions using reducing agents such as formaldehyde, hypophos-phite, borohydride, and dimethylamine borane (DMAB). All mentioned reducing agents have been used in electroless deposition of thin uniform and continuous films of various metals [21]. 

The oxidation of dimethylamine borane (DMAB), a reducing agent used in electroless plating baths [53], on gold is also assumed to involve the intervention of Au s as a mediator [54]. Similarly, the reduction of anionic oxidants such as the peroxide ion [55], HO2, may involve the intervention of Au as a reductant. Other electrocatalytic processes involving anionic species whose responses at gold in base commence and terminate at ca. 0.15 V [19] include polysulfide ion (S/ ) reduction and formaldehyde (which exists in base in anionic form, H2CO OH) oxidation. 

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