Dynamic—mechanical analytical temperature scan

The analytical techniques used to study changes in physical properties with temperature are called thermal analysis techniques. They include thermogravimetric analysis (TGA), differential thermal analysis (DTA), differential scanning calorimetry (DSC), thermometric titration (TT), and direct injection enthalpimetry, dynamic mechanical analysis (DMA), and thermomechanical analysis (TMA). Thermal analysis techniques are used in... 

While pressure sensitive adhesive performance at various temperatures can be determined by practical tests, as described above, it is also possible to predict the temperature performance of pressure sensitive adhesives. The polymers used in pressure sensitive adhesives will have a variety of glass transition temperatures (Tg), and for a pressure sensitive adhesive to be effective, the formulated mass must have a Tg of between 50°C and 70°C below the temperature at which the adhesive is to be used. At the same time, however, the Tg cannot be so low that the adhesive mass is so soft that it fails cohesively even at room temperature. A variety of analytical techniques used to determine the Tg of the adhesive mass include Differential Scanning Calorimetry (DSC), Differential Thermal Analysis (DTA), and Dynamic Mechanical Analysis (DMA). Of these, the most commonly used method is DMA. DMA will measure the bulk properties of the adhesive mass, which will include the base polymer and any additives in it. It does not take into consideration any interfacial relationships between the adhesive and the surfaces to which it is bonded. 

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