Digitial

GC-MS Experiments. GC-MS pyrolyses were carried out using a Porapak Q column 6-ft (flow rate 35 mL/min) attached to a Finnigan 4000 quadrupole GC-MS. The sample was placed in a stainless steel tube 10 cm long connected to a 4 way valve. One of the outlets was attached to a Porapak Q column interfaced with the M.S. The stainless steel tube containing a portion of Au colloid film was placed in a furnace connected to a Variac provided with a digitial quartz pyrometer to measure the temperature. Three pyrolyses were performed at 100, 200 and 350°C with the Au-acetone film. 

Dose. For rapid digitialization, 0.75 to 1.5 mg orally followed by 250 meg, every 6 hours until the desired therapeutic effect is achieved. 

Fig. 7.6 The first 1000 ms of the FID corresponding to the spectrum shown in Fig. 7.1. The digitization interval is 3.33 ms per complex data point, yielding a spectral width of 300 Hz, an unusually small spectral window. At 9.4 X H NMR is usuaiiy done with a 10 kHz spectral window, Cwith 25—50 kHz, and solid-state H with 1 MHz (and a corresponding 1 ps digiti-...

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These fractures are typically subdivided into three types depending on their location. Zone 1 is the cancellous tuberosity, which includes the insertion of the peroneus brevis and abductor digiti minimi tendons and the lateral cord of the plantar fascia. Zone 2 is the distal aspect of the tuberosity and includes dorsal and plantar ligamentous attachments to the fourth metatarsal. Zone 3 comprises the zone distal to the ligamentous attachments to the mid-diaphyseal area. 

Figure 3. Auger spectra of CdTe(lOO) taken at various points in the electrochemical digiti etching cycle. A) Argon ion bombarded, annealed surface. Cd/Te = 1.32. B) Surface resulting from oxidation at +0.25V for 5 minutes. Cd/Te = 1.08. C) Surface resulting from reduction at -LSV for 2 minutes. Cd/Te =1.34.

Cell-phones, iPODs, digitial cameras, laptops and desktop computers, DVDs, and indeed all electronic equipment in our world have one thing in common They each contain an electronic assembly composed of integrated circuits and discrete components soldered to a printed wiring board (PWB) to create an electrically functional circuit. 

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